Gland Plates
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  1. Part No. 7825360
    D: 237.5 mm (9.4 ˝)
    Cover: No
    Base plate modules, vented for TS, TS IT, SE
    Base plate module, vented for TS, TS IT, SE, for use in network enclosure base frames....
  2. Part No. 7825380
    D: 237.5 mm (9.4 ˝)
    Cover: No
    Base plate modules, vented for TS, TS IT, SE
    Base plate module, vented for TS, TS IT, SE, for use in network enclosure base frames....
  3. Part No. 7825381
    D: 237.5 mm (9.4 ˝)
    Cover: No
    Base plate modules for cable entry for TS, TS IT, SE
    Base plate module for cable entry for TS, TS-IT, SE, for use in the base frame of the...
  4. Part No. 5001130
    H: 24.5 mm (0.96 ˝) Cover: No
    Trim panel for CM, TP
    To cover the entire base opening for CM or the entire roof opening when using TopConsole...
  5. Part No. 5001140
    H: 24.5 mm (0.96 ˝) Cover: No
    Trim panel for CM, TP
    To cover the entire base opening for CM or the entire roof opening when using TopConsole...
  6. Part No. 5001150
    H: 24.5 mm (0.96 ˝) Cover: No
    Trim panel for CM, TP
    To cover the entire base opening for CM or the entire roof opening when using TopConsole...
  7. Part No. 5001160
    H: 24.5 mm (0.96 ˝) Cover: No
    Trim panel for CM, TP
    To cover the entire base opening for CM or the entire roof opening when using TopConsole...
  8. Part No. 5001210
    D: 50 mm (2 ˝)
    Cover: No
    Gland plate for CM, TP
    Equipotential bonding is provided via fastening components and grounding points.
  9. Part No. 5001211
    D: 50 mm (2 ˝)
    Cover: No
    Gland plate for CM, TP
    Equipotential bonding is provided via fastening components and grounding points.
  10. Part No. 5001213
    D: 50 mm (2 ˝)
    Cover: No
    Gland plate for CM, TP
    Equipotential bonding is provided via fastening components and grounding points.
  11. Part No. 5001214
    D: 100 mm (3.9 ˝)
    Cover: No
    Gland plate for CM, TP
    Equipotential bonding is provided via fastening components and grounding points.
  12. Part No. 5001215
    D: 100 mm (3.9 ˝)
    Cover: No
    Gland plate for CM, TP
    Equipotential bonding is provided via fastening components and grounding points.
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